lcd display fpc board

lcd display fpc 1) Material: FR4; OEM service 2) Certificate: UL, ISO, TS16949 3) T/T, Western Uni

lcd display fpc

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Our Production Capability for PCB

Layer: 1 to 28 layersMaterial type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, RogersBoard thickness: 0.21mm to 7.0mmCopper thickness: 0.5 OZ to 7.0 OZCopper thickness in hole: >25.0 um (>1mil)

- Max. Board Size: 23 × 25 (580mm×900mm)- Min. Drilled Hole Size: 3mil (0.075mm)- Min. Line Width: 3mil (0.075mm)- Min. Line Spacing: 3mil (0.075mm)

Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold platingSolder Mask Color: Green/Yellow/Black/White/Red/Blue

- Shape tolerance: ±0.13- Hole tolerance: PTH: ±0.076 NPTH: ±0.05

PCB Packing

- Inner packing: Vacuum packing / Plastic bag- Outer packing: Standard carton packing

Certificate: UL, ISO 9001, ISO 14001Special requirements: Buried and blind vias+controlled impedance +BGAProfiling: Punching, Routing, V-CUT, BevelingProvides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Contact us to check out great PCBs and full details, we will reply to you with prices in one working day!

OEM services providedCertificate: UL, ROHS, ISO9001Factory Directly

Quotation requirement

*Gerber file and BOM

*Clear photos of pcba or pcba sample deliver to us 

*PCB & PCBA function test method

Orientronic PCB Production Flow:

Data Processing →MI Examination →KaiLiu→ Grileed Plate → Inner Line → Inner Line Sezure → Layer etching → the inner layer of corrosion found → lamination → Bored → Desmear → IQC → PTH → Plate the entire board → Line Printing → Graphics transfer → line seizure →pattern plating →Tin. Nickel, Gold →Membrane back→ Etching→ Corrosion Found→Solder → Exposure → Test → Characters → Surface Treatment → IQC → Moulding → Electrical Measurement → FQC → PCBA

Orientronic SMT Production Flow:

Material Receiving → IQC  → Stock  → Material to SMT  → SMT Line Loading  → Solder Paste/Glue Printing  → Chip Mount  → Reflow  → 100% Visual Inspection  → Automated Optical Inspection (AOI) → SMT QC Sampling  → SMT Stock  →DIP → Wave Soldering  → Touch Up  → 100% Visual Inspection  →In-Circuit Test (ICT)   → Final Assembly  → Functional Test (FCT)  → Packing  → OQC Sampling  → Shipping

lcd display fpc board